Congatec COM Express conga-B915 Manual de usuario descargar pdf (Pagina 10)

Cooling Solution

Heatspreader

The speciﬁcations for Qseven™, COM Express™, XTX™ and ETX

embedded computer modules include

a heatspreader, which is a mechanical deﬁnition of the thermal interface. All the heat generated by

components such as chipsets and processors is transferred to the system’s cooling via the heatspreader.

This can be achieved by either a thermal connection to the casing, a heat pipe or a heat sink.

Thermal Stacks

The “thermal stacks” can also be used separately without a heatspreader. It is distinguished from a

heatspreader by its lack of a thermal conductive surface. This also reduces differences in tempera-

ture. The disadvantage here is its slightly more complex construction. When using heatspreaders, the

customer receives a premounted heatspreader (thermal stack + aluminum plate). The heatspreader

only has to be attached to the COM via screws. The customer has the entire heatspreader surface

available as a connector to a cooling solution. With thermal stacks the customer needs to plan the

mounting of the thermal stacks and the connection to the COM and cooling solution.

Active and passive standard cooling solutions

Compared with sandwich-type constructions for heatspreaders and coo-

ling systems, active and passive cooling solutions remove one layer from

the process. The heatspreader and cooler are manufactured as one unit,

which enables them to provide faster thermal conduction. For an active

cooling solution, a high performance quiet fan has been integrated

within the cooling ﬁns.

active cooling solution

Thermal simulation

of an active cooling solution

passive cooling solution

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Congatec COM Express conga-B915 Manual de usuario Pagina 10